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ASML takes action to adjust its organization due to severe order slowdown
ASML Holding NV (ASML) announces that it has seen a severe deterioration in its order intake due to the global economic crisis. “Never before have we witnessed such a sharp and sudden fall-off in lithography system demand, triggered by an unprecedented mix of falling ...

SUSS MicroTec Announces ProberBench™ Operating Environment
SUSS MicroTec Test Systems has revealed the ProberBench™ Operating Environment, a full-featured software suite for efficient, intuitive and safe wafer-level probing. In 1995, SUSS revolutionized wafer-level test by introducing the first Windows-based prober control software. ...

Tokyo Electron Limited (TEL) Announces Wafer-Level MEMS Tester TEMEON™-C for Capacitive MEMS devices.
Tokyo Electron Limited (TEL) has announced at Semicon Japan 2008 a new wafer-level MEMS tester TEMEON™-C for Capacitive MEMS devices as part of the TEMEON™ family. In 2006, TEL released TEMEON™-M to test Piezo resistive MEMS sensors at the wafer level and it is currently in ...

EV Group introduces new suite of aligners and measurement systems for 3D IC, advanced Semiconductor, MEMS and Nanotechnology device
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the NT series-a new, yet already field-proven suite of mask aligners, wafer-to-wafer (W2W) bond aligners and measurement ...

STS installs Pegasus DRIE cluster systems for Korea’s NIA
Surface Technology Systems plc (STS), a leader in plasma process technologies required in the manufacturing and packaging of micro electromechanical systems (MEMS) and advanced electronic devices, today announced that they have installed two VPX Pegasus cluster tools for the ...

EV Group receives multiple-system ordersfrom leading European universities for innovative MEMS research & development
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that three European universities -- Southampton University, University of Ulster and Technische Universitat Braunschweig -- have ...

SUSS MicroTec introduces next generation manual mask aligner for industrial research and operator-assisted production
SUSS MicroTec, supplier of innovative solutions for 3D Integration (3DI), MEMS, Advanced Packaging and Nanotechnology markets, launches the third generation of its MA/BA8, a manual mask and bond aligner that offers highest process flexibility including submicron alignment and ...

Fraunhofer IMS installs the latest memsstar® technology SVR etch capability
memsstar® Technology, etch and deposition equipment supplier to the global MEMS industry, announced the successful installation and process qualification of one of its SVR (Sacrificial Vapour Release) etch systems.As part of a further expansion of advanced capabilities for ...

STS and SPP announce the formation of SPP Global Business Services
Surface Technology Systems plc (STS) and Sumitomo Precision Products Co., Ltd (SPP), leaders in plasma process technologies required in the manufacturing of advanced electronic devices and micro electromechanical systems (MEMS), are pleased to announce the formation of SPP ...

IQE Launches new epitaxy services for enhanced MEMS capabilities
Engineered substrates enable the greatest degree of flexibility in both the design and manufacture of MEMS devices, allowing customers to design their products free of the limitations imposed by standard bulk silicon substrates. IQE’s dedicated silicon facility, now offers a ...

Aviza Technology receives multiple orders for its Omega fxP etch systems for deep silicon etch applications
Aviza Technology, Inc. (NASDAQ:AVZA), a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, announced multiple orders for its 200 mm and 300 mm Omega fxP etch systems and deep silicon (DSi) ...

SUSS MicroTec announces CB Series wafer bonders for advanced MEMS
SUSS MicroTec, a leading supplier of process and test solutions for the semiconductor industry, announces the CB Series, semi and fully automated wafer bonders, for Advanced MEMS devices for the automotive and consumer markets. There are a variety of wafer level bonding ...

ACUTRONIC USA announces the AC217 TWO-AXIS motion table for the MEMS insdustry
ACUTRONIC USA announced the release of the AC217 two-axis motion table, a new product aimed at providing manufacturers of inertial MEMS devices and inertial MEMS-based products a cost effective solution for product testing. Optimized for the testing of MEMS inertial ...

First 8'' MEMS cluster tool from Oerlikon on its way to Korea
In June, u-IT Cluster Center, a Korean RFID/USN infrastructure facility providing foundry service of MEMS Sensors (USN Fab) and RFID/USN related activities from design to testing of RFID/USN products (RFID/USN Engineering Lab), signed a contract for purchasing a CLUSTERLINE(R)...

STS celebrate order for 100th Pegasus DRIE module
Surface Technology Systems plc (STS), a leader in plasma process technologies required in the manufacturing and packaging of micro electromechanical systems (MEMS) and advanced electronic devices, announced that they have sold a “Pegasus” Deep Reactive Ion Etch (DRIE) tool to ...

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