•Best of breed specialty process offering of CMOS Image Sensor (visible and non-visible), Radio Frequency (RF CMOS, SiGe and BiCMOS) and Power Management (CMOS and BCD) solutions•Operational facilities spanning the globe with three fully owned fabrication facilities in the United States and Israel and an ownership interest in a fabrication facility in China•Significant opportunity for revenue ...

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Founded in 1980, EV Group (EVG) is a global supplier of wafer bonders, aligners, thin wafer-, temporary bonding and debonding-equipment, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EV Group holds the dominant share of the market for wafer bonding and debonding equipment and is a leader in lithography for advanced packaging, ...

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This exclusive report, jointly published by Chipworks and Yole Developpement, analyzes the technology and economics behind toshiba’s latest Dynastron CMOS Image sensor. Leveraging downstream product teardowns and semiconductor reverse engineering this report provides evidence-based analysis on the technical achievements and cost of the device....

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