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> Cypress presents High Speed CMOS image sensor in a WL-CSP p...
> ADVANCED PACKAGING: 3D IC, WLP & TSV
Nov 21st, 2008
Cypress presents High Speed CMOS image sensor in a WL-CSP package
According to Cypress, the vastly increasing amount of data, along with lower material costs, has made holographic storage a valid option for high-speed data access
Over the last decade, the amount of information to be processed in
image-capture systems has increased dramatically. This leads to an
increase of storage capacity as well, while there is the continuing
need for reducing device size and cost.
High-speed CMOS image sensors produced by Cypress Semiconductor (Mechelen, Belgium) and specifically laid out for motion capture at high frame rates can be applied in holographic data storage systems. Their resolution ranges from 0.4 up to 3Mp and they run at 485 full frames per second. Data storage and data access usually are done by means of magnetic and optical devices. However, this has the disadvantage of reading from and writing to memory just single bits. Holographic data storage uses a volumetric approach. It therefore can access substantially more data units per operation. Holographic storage has existed for a long time, but the vastly increasing amount of data, along with lower material costs, has made it a valid option for high-speed data access. High-speed image sensors can read the data from the storage element, thus processing multiple bits simultaneously. The picture of the LUPA-400 sensor clearly shows that Cypress used a ShellCase-OP type of WL-CSP to package its sensor with electrical "T-contacts" formed at the edge of the chips. WL-CSP kind of CMOS image sensors are appearing since 3 years in diverse markets such as camera cell-phones, notebook webcams, medical sensor and other embedded sensor applications. Main driver for the use of this type of packaging is small form factor and low cost encpasulation. WL-CSP packaging services are today available through Xintec (TW), WLCSP (China), OKI/ZyCube (JP) and Nemotek (MO). Sources:
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