Tessera announced today that Q Technology Limited (Qtech) has licensed Tessera's SHELLCASE MVP image sensor packaging technology

The market continues to demand smaller form factor packages with enhanced reliability and lower cost for image sensor packaging. Tessera's SHELLCASE wafer-level chip-scale packaging (WLCSP) includes the latest advancements in image sensor packaging technology and delivers a highly reliable manufacturing solution for image sensors used in next-generation mobile devices including cell phones and PDAs.

"The continued demand for smaller, lower cost, surface mountable camera modules makes our SHELLCASE MVP solution the ideal packaging technology for Qtech's target customers: the manufacturers of cell phones and laptops," said Michael Bereziuk, executive vice president, Imaging & Optics, Tessera. "This latest generation SHELLCASE solution is not only the lowest cost and most reliable image sensor packaging technology we have ever released, but its small form factor - made possible through the use of through silicon via technology - makes it suitable for a wide range of camera module applications including cell phone cameras."
 
Qtech, based in China, manufactures compact camera modules for the worldwide cell phone, notebook computer and security and protection markets. "Tessera's SHELLCASE leading-edge wafer-level packaging technology will help us to successfully compete in the highly competitive, rapidly evolving global consumer electronics market," said Dr. Hao Zhou, CEO, Qtech. "With Tessera as our R&D provider for existing and future wafer-level packaging, our customers will increasingly benefit from Tessera's WLCSP technology with its stronger performance and lower cost."