Toshiba CMOS image sensor with TSV

The analyzed device is an image sensor module, produced by Toshiba, and found inside a mobile phone. According to market research company Yole Developpement, "3-D TSV wafer level encapsulation technologies have the potential to impact as much as 70% of the CMOS image sensor market for camera cell phones by 2012." Toshiba's customers for this device are consumer products manufacturing companies who will benefit from a smaller footprint and a lower cost manufacturing process – a benefit confirmed by the analysis Chipworks has completed to date.

"As predicted by Chipworks, image sensors have proven to be the first successful implementation of TSV technology on the market," said Gary Tomkins, VP Technical Intelligence, Chipworks. "However, manufacturers with complex packaging, or those needing to stack dice, will benefit from this technology including memory manufacturers such as Samsung, Hynix, and Micron, and image sensor manufacturers such as Aptina, Omnivision, and Sony."

Chipworks' analysis will deliver the level of detail required by engineering and senior management teams by taking them inside the process, using a combination of very high magnification TEM and SEM imaging, materials analysis, and engineering expertise. Toshiba is the first out with a commercially available device that uses TSV technology. They call their implementation, "TCV" for Through-Chip-Via. This allows mounting and assembly of camera components at the wafer level (WLP), savings overall module size and yielding smaller design footprints. Toshiba announced that this technology will be leveraged primarily in cameras designed for mobile applications and ranging up to 3 Mp in resolution.

Contents of the report include:

• Introduction and Overview
• Device Identification
• Basic Process Analysis
• TSV/3DIC Process Analysis
  • Detailed analysis of vias diameter, taper, etc.
  • TEM of liners and barriers
  • SEM-EDS of materials used

Companies interested in this report may contact Chipworks at insidetechnology@chipworks.com or via phone at + 613-829-0414.

About Chipworks
Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company's ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world's largest semiconductor and microelectronics companies. These companies depend on Chipworks to secure, defend, and grow market share, and to save millions of dollars in royalty payments and product design costs, allowing them to earn millions by licensing patents, designing superior products, and launching new products faster. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation. Research and Development and Product Management rely on Chipworks for success in new product design and launch. Headquartered in Ottawa, Canada, Chipworks maintains offices in Japan, Korea, Taiwan, Israel, and Poland.